Use Cases

High-Speed Solutions for High-Performance Systems at Edge

The relentless pursuit of smaller, yet more powerful computing systems intersects with the demand for superior performance, heralding a new era of technological innovation. The introduction of advanced high-speed connectors and sockets is pivotal, engineered to meet the exacting demands of next-generation computing. These components are key in driving the boundaries of data transmission and processing capabilities forward. This overview delves into the transformative impact of M.2 sockets, DDR5 sockets, and MXM2/3.0 connectors.

Advancing High-Speed Solutions for Next-Generation Systems

M.2 Sockets: Leading the Charge in Data Transmission


M.2 sockets are at the forefront of high-speed data transmission, leveraging PCI Express 3.0, SATA 3.0, and USB 3.0 protocols. Fully compliant with PCI-SIG PCIe M.2 specifications, this high-density PCIe® connector is designed to maximize the use of compact PCB space, essential for high-demand applications.

The introduction of M.2 Gen 5 specification marks a notable advancement, with data transmission speeds reaching up to 32.0 GT/s, doubling the capability of its predecessor. The versatility of M.2 Socket B KEY and M KEY configurations support SSDs, PCIe 5.0, and a range of other interfaces, ensuring seamless integration with the latest processors.

DDR5 Sockets: Setting New Standards

DDR5 sockets herald a significant leap in computing performance. Doubling the data transfer rates compared to DDR4, DDR5 enhances bandwidth dramatically. This transition to DDR5 brings an increase in base clock frequency and doubles the number of Bank Groups, leading to unparalleled data throughput.

Furthermore, DDR5 introduces improved power efficiency, operating at a reduced nominal voltage, which translates to a 20% decrease in power consumption compared to DDR4. This efficiency is crucial for devices that demand extended battery life and for continuous operation in enterprise servers, contributing to greater energy sustainability.
The expansion in memory capacity with DDR5 is also noteworthy, supporting chips up to 16GB and modules up to 256 GB. This capacity boost is vital for intensive computing applications, ensuring efficient data processing and storage.

MXM2/3.0 Connectors: Empowering Versatile Computing

MXM2/3.0 connectors are essential for enabling versatile, high-speed embedded computing systems. They provide a robust platform for integrating advanced graphics and processing capabilities across various applications, ensuring optimal performance and adaptability.

Designed to perform in challenging environments, these connectors operate within a broad temperature range of -40℃ to +85℃, suitable for equipment functioning below 70℃. Their durability, tested up to 60 cycles, guarantees reliable performance under demanding conditions.


The evolution of computing is propelled by innovations in high-speed, high-performance solutions. M.2 sockets, DDR5 sockets, and MXM2/3.0 connectors stand at the forefront of this evolution, exemplifying the push towards more efficient, powerful, and reliable systems. These components not only elevate the capabilities of next-generation computing but also redefine performance and efficiency standards in the industry.

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