ATTEND Launches Floating Board-to-Board Connector Series

ATTEND, a leading provider of advanced connectivity solutions, today announces the release of its Floating Board-to-Board Connector series, featuring an integrated compliant mechanism that accommodates X- and Y-axis PCB misalignment up to ±0.5 mm. This adaptive architecture ensures stable, high-speed signal transmission even under dynamic mechanical stress, thermal cycling, and vibrational loading, delivering robust performance for automotive, industrial, and embedded computing applications.

Conventional board-to-board interconnects frequently exhibit susceptibility to assembly-induced mechanical stress, contact degradation under vibrational environments, and insufficient tolerance for PCB positional variance. The Floating series mitigates these limitations through an engineered compliant contact architecture, 0.5 mm fine-pitch configuration across multiple pin densities, and a proprietary elastic compensation mechanism that accommodates ±0.5 mm positional deviation in both X and Y axes. This advanced design architecture minimizes mechanical stress concentration, ensures consistent electrical continuity, and enhances system reliability in mission-critical applications.

"Through comprehensive validation testing, we have verified that the Floating Board-to-Board series maintains stable high-speed signal transmission up to 8 GT/s while demonstrating resilience to vibrational stress, mechanical shock, and thermal cycling," said Leon Hung, Product Manager at ATTEND. "The integrated floating compensation mechanism reduces assembly-related mechanical stress and provides enhanced design latitude, positioning it as an optimal interconnect solution for next-generation automotive electronics, industrial automation platforms, and high-performance embedded computing systems."