Micro SIM Socket Hinge Type, 8 Pin
115R-BCA0
Micro SIM Card Socket Hinge Type, 8 Pin, 5u''
SIM card connector series is a well-known integrated circuit module which mainly used to store the International Mobile Subscriber Identity (IMSI) securely, and its related key to identifying subscribers on mobile devices. Sim card format has been shrunk gradually because the design tends to be miniature and portable, the result is the development of Micro SIM, Mini-SIM, and the Nano-SIM. ATTEND offers multiple selections, including push-push, push-pull, hinge, bar push, holder, and eject type. Most of them are also featured in stability, durability and a wide range of operating temperatures as a perfect tracking solution for embedded and industrial systems.
SIM card connector series is a well-known integrated circuit module which mainly used to store the International Mobile Subscriber Identity (IMSI) securely, and its related key to identifying subscribers on mobile devices. Sim card format has been shrunk gradually because the design tends to be miniature and portable, the result is the development of Micro SIM, Mini-SIM, and the Nano-SIM. ATTEND offers multiple selections, including push-push, push-pull, hinge, bar push, holder, and eject type. Most of them are also featured in stability, durability and a wide range of operating temperatures as a perfect tracking solution for embedded and industrial systems.
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功能介紹

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超薄 1.45 mm 高度設計,適用於高度受限的精密裝置。
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金屬轉軸結構提供高拉力,確保卡片穩固固定。
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高耐用度與業界領先的穩定設計,確保長期使用可靠。
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卡片插入順暢且接觸穩定。
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適用於行動裝置、IoT 模組與各類小型嵌入式設備。
應用領域

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工業物聯網(IIoT)
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Wi-Fi 模組
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智慧電表
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LTE 路由器
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工控電腦/POS 系統
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車輛追蹤設備
規格介紹
| Current Rating | 0.5A Max. |
|---|---|
| Voltage Rating | 10V AC/DC |
| Contact Resistance | Initially 50mΩ Max. |
| Contact Resistance | Finally 100mΩ Max. |
| Insulation Resistance | 1000MΩ Min. |
| Dielectric Withstanding Voltage | 500V AC |
| Contact Normal Force | 0.3N Min./ Pin |
|---|---|
| Durability | 50 Cycles |
| Operating temperature range | -30°C~+85°C |
|---|---|
| Storage temperature range | -40°C~+85°C |
| Storage Humidity | +10%~+80% RH |
| Recommended IR Reflow(Wave Soldering) Temperature | 260℃ |
|---|







