Nano SIM Socket, Tray Eject Type
115S-ACA0
Nano SIM Card Connector, Eject Type, Top Mount, H=1.35mm, 5u''
The Nano SIM (also known as the 4FF) card only measure 12.3 × 8.8 × 0.67 mm, the original design purpose was fit the mobile device. Even it reduces the area, it still maintaining the existing contact arrangements and provide all designer another solution to saving the cost in PCB layout design. As the professional communication solution provider, ATTEND Tech offering the maximizing options to fit with any request, including the bar push eject type with multiple tray option, push-push type, hinge type and dual bar push eject type.
The Nano SIM (also known as the 4FF) card only measure 12.3 × 8.8 × 0.67 mm, the original design purpose was fit the mobile device. Even it reduces the area, it still maintaining the existing contact arrangements and provide all designer another solution to saving the cost in PCB layout design. As the professional communication solution provider, ATTEND Tech offering the maximizing options to fit with any request, including the bar push eject type with multiple tray option, push-push type, hinge type and dual bar push eject type.
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功能介紹
Conclusion:
Featured a convenient, and quick card insertion /ejection with a rugged mini size bar push linkage mechanism.
The customized hinge, rubber, and door (Additional accessories) for a waterproof function(115S-ACA1) or different length tray to fit with your device design.
Featured a convenient, and quick card insertion /ejection with a rugged mini size bar push linkage mechanism.
The customized hinge, rubber, and door (Additional accessories) for a waterproof function(115S-ACA1) or different length tray to fit with your device design.
- Mini size rugged bar push linkage mechanism
- Unnecessary to open device housing
- Selectable tray option
規格介紹
| Current Rating | 0.2A max. |
|---|---|
| Voltage Rating | 10VAC/DC |
| Contact Resistance | 50mΩ |
| Insulation Resistance | 1000MΩ |
| Dielectric Withstanding Voltage | 500VAC |
| Durability | 2,000 Cycle |
|---|---|
| Tray Insertion Force | 20N max. |
| Tray Extraction Force | 3N min. |
| Contact Normal Force | 40gf min. per pin |
| Operating temperature range | -30°C~+85°C |
|---|---|
| Storage temperature range | -40°C~+85°C |
| Recommended IR Reflow(Wave Soldering) Temperature | 260°C |
|---|
下載
| 類別 | 標題 | 大小 | 文件類型 | 下載 |
|---|---|---|---|---|
| 圖面 | 115S-ACA0 | 594 KB | PDF: 工程用圖面 |  |
| 3D | 115S-ACA0 | 983 KB | RAR: 3D檔 | |
| 圖面 | 115S-ACA3 | 90 KB | PDF: 工程用圖面 | |
| 3D | 115S-ACA3 | 850 KB | RAR: 3D檔 | |
| 圖面 | 115S-ACA2 | 92 KB | PDF: 工程用圖面 | |
| 3D | 115S-ACA2 | 836 KB | RAR: 3D檔 | |
| 圖面 | 115S-ACA1 | 154 KB | PDF: 工程用圖面 | |
| 3D | 115S-ACA1 | 274 KB | RAR: 3D檔 | |
| 規格書 | 115S-Spec | 518 KB | PDF:規格書 | |
| 圖面 | 115S-ACA3A | 81 KB | PDF: 工程用圖面 | |
