LPDDR5 CAMM2 Connector, 666 Pin, H=1.00mm
127A-10D00
LPDDR5 CAMM2 Connector, 666 Pin, H=1.00mm
ATTEND’s LPDDR5 CAMM2 connector is a next-generation, high-performance memory interface combining LPDDR5 speed and low power with modular CAMM2 design, fully JEDEC-compliant. Its compression-based, screw-fixed design allows removable, upgradeable modules while maintaining excellent signal integrity. With a low-profile, 666-pin layout, it supports data transfer up to 9600 MT/s, making it ideal for AI PCs, thin laptops, and high-performance systems, offering flexible and future-ready high-speed solutions.
ATTEND’s LPDDR5 CAMM2 connector is a next-generation, high-performance memory interface combining LPDDR5 speed and low power with modular CAMM2 design, fully JEDEC-compliant. Its compression-based, screw-fixed design allows removable, upgradeable modules while maintaining excellent signal integrity. With a low-profile, 666-pin layout, it supports data transfer up to 9600 MT/s, making it ideal for AI PCs, thin laptops, and high-performance systems, offering flexible and future-ready high-speed solutions.
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MAIN FEATURES

- HComplies with JEDEC SO‑032 specification.
- Supports data transfer rates up to 9,600 MT/s with enhanced signal integrity.
- Compression contacts ensure consistent and reliable electrical connection.
- Low-profile design saves system mounting space and improves airflow.
- Operates at 1.05V for energy-efficient performance.
- Supports up to 128GB memory per connector without BGA soldering.
- Screw-lock mechanism enhances vibration and shock resistance.
APPLICATION

- Thin & Light Laptop
- AI PCs
- Desktop PCs
- Workstations
- Servers
- Embedded Systems & Edge AI Devices
SPECIFICATION
| Rated Current | 1.0 AMP |
|---|---|
| Rated Voltage | 25 VAC |
| Low Level Contact Resistance | 50mΩ Max. (initial) △20mΩ Max. (final) |
| Durability | 25 cycles |
|---|
| Operating Temperature | -55°C to +85°C |
|---|---|
| Storage Temperature | -55°C to +85°C |
| Housing | Thermoplastic UL94-V0 |
|---|---|
| Contact | Copper alloy, 10u” gold plating on contact area, 50u” min. nickel under plating over all |







