USB3.0 A Type, Dual port, DIP
209B-DA12
USB 3.0 A Receptacle Dual Port DIP, G/F, LCP
ATTEND’s USB 3.0 A Dual-Port Receptacle features a DIP-type through-hole design with Grounding Fingers (G/F) for enhanced EMI shielding and signal integrity. Constructed with high-performance LCP (Liquid Crystal Polymer) housing, this connector offers superior heat resistance and mechanical stability.
The dual-port configuration supports high-speed USB 3.0 data transmission (up to 5 Gbps), making it ideal for applications that demand reliable, high-bandwidth connectivity in compact board layouts. Suitable for industrial computers, communication systems, and embedded devices.
ATTEND’s USB 3.0 A Dual-Port Receptacle features a DIP-type through-hole design with Grounding Fingers (G/F) for enhanced EMI shielding and signal integrity. Constructed with high-performance LCP (Liquid Crystal Polymer) housing, this connector offers superior heat resistance and mechanical stability.
The dual-port configuration supports high-speed USB 3.0 data transmission (up to 5 Gbps), making it ideal for applications that demand reliable, high-bandwidth connectivity in compact board layouts. Suitable for industrial computers, communication systems, and embedded devices.
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SPECIFICATION
| Current Rating | 1.8A |
|---|---|
| Voltage Rating | 30VAC |
| Contact Resistance | 30mΩ |
| Insulation Resistance | 50MΩ |
| Dielectric Withstanding Voltage | 100V AC |
| Insulation Resistance | 100MΩ MIN. |
| Durability | 5000 Cycle |
|---|
| Operating temperature range | -55℃~+85℃ |
|---|---|
| Storage temperature range | -55℃~+85℃ |
| Recommended IR Reflow Temperature | 260℃ |
|---|---|
| Recommended PCB Thickness | 260℃ |
DOWNLOAD
| CATEGORY | TITLE | SIZE | FILE TYPE | DOWNLOAD |
|---|---|---|---|---|
| Drawing | 209B-DA12 | 324 KB | PDF: Drawing |  |
| 3D | 209B-DA12 | 633 KB | RAR: 3D File | |
