Dual Nano SIM Socket, Tray-Push Push

115U-B100

Dual Nano SIM Socket, Tray-Push Push, 6 Pin, Lock w/Switch, G/F

ATTEND’s 115U-B100 is a user-friendly, space-saving dual Nano SIM card connector with a push-push tray design, offering vibration resistance and continuous signal performance. Featuring a card friction lock and foolproof design, it ensures proper tray installation with SIM 1 facing up and includes a tray lock function for added stability and shock resistance. The separate tray prevents reverse insertion for accurate mating and is reliable in diverse environments.

***Patent Cert. No.: TWM625102, CN217036175U

AVAILABLE ACCESSORIES

MAIN FEATURES

Tray Push-Push Type Dual Nano-SIM Socket (Tray is separated)
Card detection and tray insertion with anti-reverse protection
Extended 6mm ejection length for easy card removal
2mm tray edge for adaptable panel/casing design
Tray lock function for robustness against shock
Tested to 5,000 mating cycles
Operating temperature: -40°C to +85°C
Passed EN60721-3-5 Class 5M3 random vibration and Level II shock tests

ATTEND’s Tray Push-Push series offers two models to choose from: the 115U-A101, which supports a single Nano SIM card connector, and the 115U-B100, which supports dual Nano SIM card connectors. Both models are designed for easy installation while maintaining robust, vibration-resistant features suitable for industrial and automotive applications. To complete a purchase, make sure to also acquire the 115U-T001 (for use with the 115U-A101) and the 115U-T003 (for use with the 115U-B100) trays.

APPLICATIONS

Telematics and V2X
IIoT
Smart meter
Gateway and Router
M2M
Mobile devices
Security and surveillance

SPECIFICATION

ELECTRICAL
Current Rating	0.5A per pin
Voltage Rating	10V DC
Contact Resistance	100mΩ Max.
Insulation Resistance	1000MΩ
Dielectric Withstanding Voltage	500VAC

MECHANICAL
Durability	5,000 cycles
Contact Normal Force	0.5N Max. per pin
Tray Lock Force	3N Min.

ENVIRONMENTAL
Operating temperature range	-40°C~+85°C
Storage temperature range	- 40°C~+85°C

SOLDER ABILITY
Recommended IR Reflow Temperature	260°C

DOWNLOAD

CATEGORY	TITLE	SIZE	FILE TYPE
Drawing	115U-B100	239 KB	PDF: Drawing
3D	115U-B100	742 KB	RAR: 3D File
Drawing	115U-T003	78 KB	PDF: Drawing
Datasheet	115U-B100	313 KB	PDF:Spec
Drawing	115U-T005	82 KB	PDF: Drawing