Micro SIM Socket Hinge Type, 8 Pin
115R-BCA0
Micro SIM Card Socket Hinge Type, 8 Pin, 5u''
SIM card connector series is a well-known integrated circuit module which mainly used to store the International Mobile Subscriber Identity (IMSI) securely, and its related key to identifying subscribers on mobile devices. Sim card format has been shrunk gradually because the design tends to be miniature and portable, the result is the development of Micro SIM, Mini-SIM, and the Nano-SIM. ATTEND offers multiple selections, including push-push, push-pull, hinge, bar push, holder, and eject type. Most of them are also featured in stability, durability and a wide range of operating temperatures as a perfect tracking solution for embedded and industrial systems.
SIM card connector series is a well-known integrated circuit module which mainly used to store the International Mobile Subscriber Identity (IMSI) securely, and its related key to identifying subscribers on mobile devices. Sim card format has been shrunk gradually because the design tends to be miniature and portable, the result is the development of Micro SIM, Mini-SIM, and the Nano-SIM. ATTEND offers multiple selections, including push-push, push-pull, hinge, bar push, holder, and eject type. Most of them are also featured in stability, durability and a wide range of operating temperatures as a perfect tracking solution for embedded and industrial systems.
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MAIN FEATURES
INTRODUCTION:
- Metal hinge provides high pulling force
- High durability and industry-leading stable design
- Low profile 1.45mm height
APPLICATION:
- IIOT
- WIFI Module
- Smart Meter
- LTE Router
- IPC / POS
- Vehicle Tracking
SPECIFICATION
Current Rating | 0.5A Max. |
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Voltage Rating | 10V AC/DC |
Contact Resistance | Initially 50mΩ Max. |
Contact Resistance | Finally 100mΩ Max. |
Insulation Resistance | 1000MΩ Min. |
Dielectric Withstanding Voltage | 500V AC |
Contact Normal Force | 0.3N Min./ Pin |
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Durability | 50 Cycles |
Operating temperature range | -30°C~+85°C |
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Storage temperature range | -40°C~+85°C |
Storage Humidity | +10%~+80% RH |
Recommended IR Reflow(Wave Soldering) Temperature | 260℃ |
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