SIM Card Socket Push-Push Type, 8+2 Pin
115A-BDA0-R01
SIM Card Socket Push-Push Type, 8+2 Pin w/switch, 10u''
SIM card connector series is a well-known integrated circuit module which mainly used to store the International Mobile Subscriber Identity (IMSI) number securely, and its related key to identifying subscribers on mobile devices. Sim card format has been shrunk gradually because the design tends to be miniature and portable, the result is the development of mini SIM, Micro SIM and Nano SIM. ATTEND offers multiple selections, including push-push, push-pull, hinge, bar push, holder, and eject type. Most of them are also featured in stability, durability and a wide range of operating temperatures as a perfect tracking solution for embedded and industrial systems.
SIM card connector series is a well-known integrated circuit module which mainly used to store the International Mobile Subscriber Identity (IMSI) number securely, and its related key to identifying subscribers on mobile devices. Sim card format has been shrunk gradually because the design tends to be miniature and portable, the result is the development of mini SIM, Micro SIM and Nano SIM. ATTEND offers multiple selections, including push-push, push-pull, hinge, bar push, holder, and eject type. Most of them are also featured in stability, durability and a wide range of operating temperatures as a perfect tracking solution for embedded and industrial systems.
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MAIN FEATURES
INTRODUCTION:
- Low profile 1.85 mm height
- Push-to-insert, push-to-eject mechanism for easy card insertion and removal
- Card detection pins
- PCB alignment pegs
- 8 circuit plus 2 card detection switch circuit
APPLICATION:
- IIOT
- WIFI Module
- Smart Meter
- LTE Router
- IPC / POS
- Vehicle Tracking
SPECIFICATION
| Housing | LCP+ 30％G.F., UL94V-0 rated, color: black |
|---|---|
| Contacts | copper alloy |
| Shield cover | SUS304, 0.2T. |
| Contact area | gold plating over 1.27μm (30 μ") min., nickel underplating |
|---|---|
| Soldering zone | 3.05μm (120 μ") min. 100% tin, or lead-free plating per part number designation, over nickel underplating |
| Shield cover | gold flash nickel underplatlng |
| Underplating | 1.27μm (30 μ") min. nickel allover. |
| Cutting burr allowed | 0.03mm max. Coplanarity is 0.10mm max. |
DOWNLOAD
| CATEGORY | TITLE | SIZE | FILE TYPE | DOWNLOAD |
|---|---|---|---|---|
| Drawing | 115A-BDA0-R01 | 245 KB | PDF: Drawing |  |
| 3D | 115A-BDA0-R01 | 286 KB | RAR: 3D File | |
